Aug. 06, 2024
Machinery
- Advertisement -
With competitive price and timely delivery, Rdekono sincerely hope to be your supplier and partner.
The final step in creating a semiconductor device is integrated circuit packaging, which involves encasing the semiconductor material block (on which a given functional circuit is fabricated) in a protective case to protect it from physical harm and corrosion. There are many types of IC packages, each having unique dimensions, mounting styles, and pin counts.
The most common IC package types include-
It is the most common through-hole IC package used in circuits, especially hobby projects. This IC has two parallel rows of pins extending perpendicularly out of a rectangular plastic housing.
- Advertisement -
The overall dimensions of a DIP package depend on its pin count. The most common pin counts are four, six, eight, fourteen, eighteen, twenty, twenty-eight, and forty pins. The pins on a DIP IC are spaced 2.54mm apart, which is a standard spacing, perfect for fitting into breadboards, veroboards, and other prototyping boards.
A DIP IC can also be easily soldered on PCBs. Sometimes, an IC socket is used instead of soldering an IC directly to the PCB. Using the socket allows for the DIP IC to be removed from and inserted into the PCB easily.
There are a variety of surface-mount packages including SOP, small-outline transistor (SOT), and QFP available in the market. SMD IC packages usually need custom PCBs, containing a matching pattern of copper on which they are to be soldered. Usually, special automated tools are used to solder these on PCBs.
SOIC package is shorter and narrower than DIP. It is an SMD with all DIP pins bent outwards and shrunk down to size. Each pin is usually spaced about 1.27mm from the next.
This is an even smaller version of the SOIC package. Similar to SOIC, the SOP family has a smaller form factor, with pin spacing of less than 1.27mm. Each SOP includes a plastic small-outline package (PSOP), thin small-outline package (TSOP), and thin-shrink small-outline package (TSSOP).
Unlike DIP having two sides, QFP IC has pins on all four sides. A QFP IC can have pins anywhere from eight per side (32 total) to upwards of seventy (300+). Pins on a QFP IC are usually spaced anywhere from 0.4mm to 1mm apart.
Smaller variants of the standard QFP package include thin QFP (TQFP), very-thin QFP (VQFP), and low-profile QFP (LQFP) packages.
There is another QFP IC type, but with a different pin structure, called the QFN package. Pins on a QFN package are exposed on the bottom and sometimes on both sides and the bottom.
SMD devices such as rectangular transistors are available in SOT packages.
Advanced ICs are available in BGA packages. These amazingly intricate packages have small balls of solder arranged in a 2D grid on the bottom. Usually, putting these packages onto a PCB requires an automated procedure involving pick-and-place machines and reflow ovens. BGA packages are found on pcDuino and Raspberry Pi boards.
Also Check: IC Package Technique
IC (Integrated Circuit) is one of the most important electronic components, due to the complex functions and uses involved, there are many types of ICs. In order to facilitate the management, IC chips were defined as various standard packages.
IC packaging indicates the dimension and shape of a chip. Chips with the same electronic parameters may have different IC packages. IC package types are mainly divided into traditional DIP dual-in-line and SMD chip package, they are soldered by different methods (Wave soldering & Reflow soldering).
The leads are led out from both sides of the body, the materials include plastic and ceramic. DIP applications include standard logic ICs, memory LSIs, and microcomputer circuits.
The pin pitch of DIP is typically 15.2mm. Some packages with widths of 7.52mm and 10.16mm are called skinny DIP and slim DIP (narrow-body DIP). However, in most cases, it is not differentiated and is simply referred to as DIP.
The pins are drawn in an L shape from both sides of the body, the materials include plastic and ceramic. In addition to being used for memory LSI, SOP is also widely used in circuits such as ASSP that is not too large. The pin pitch is 1.27mm and the number of pins is from 8 to 44.
SOP derives some more IC packaging types, as follows:
SOJ (Small Out-Line J-Leaded Package): J-lead small outline package
TSOP (Thin Small Outline Package): This IC packaging is thinner than SOP with a pin pitch of 1.27mm
SSOP (Shrink Small Outline Package): Pin pitch is 0.635mm
TSSOP (Thin Shrink Small Outline Package): This IC package type is thinner than SOP with a pitch of 0.65mm
QSOP (Quarter-size Small Outline Package): Pin pitch is 0.635 mm
VSOP (Very Small Outline Package): It is smaller than QSOP and has a pitch of 0.4, 0.5 or 0.65 mm
Further reading:
Contact us to discuss your requirements of Subracks Electronic Packaging Systems. Our experienced sales team can help you identify the options that best suit your needs.
Get An Instant Quote
The leads are led out from four sides in an L-shape, the materials are ceramic, metal and plastic, among which, plastic packaging accounts for the vast majority.
The pin pitches include 1.0mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm, 0.3mm and other specifications. The maximum number of pins of 0.65mm package is 304.
Depending on the thickness of the package body, QFP currently has the following variants:
LQFP (Flat Quad Flat Pack): The height of the IC packaging body is 1.4 mm
TQFP (Thin Quad Flat Pack): Height is 1.0mm
PQFP (Plastic Quad Flat Package): PQFP package has a small pitch and a very small pin. Generally, large-scale or very large-scale integrated circuits use this IC packaging, and the pin count is generally above 100
CQFP (Ceramic Quare Flat Package): Ceramic version of PQFP
BQFP (Quad Flat Package with Bumper): This package has protrusions (cushions) at the four corners to prevent bending deformation of the pins during shipping. The pin pitch is 0.635mm, and the number of pins is from 84 to 196
The four sides of this IC packaging are equipped with electrode contacts. Due to the absence of leads, the mounting area is smaller than QFP and the height is lower than QFP.
The number of electrode contacts is generally from 14 to 100, the materials are ceramic and plastic. When there is an LCC mark, it is basically a ceramic QFN, of which the spacing of electrode contacts is 1.27 mm.
Plastic QFN has different pin pitches of 0.65mm, 0.5mm, and 1.27mm, this package is also known as PLCC.
Spherical bumps are formed on the back surface of the printed substrate to replace the lead, and the LSI chip is mounted on the front surface of the PCB board, and then sealed by a molding resin or a potting method, the pins can exceed 200.
The package body can be made smaller than QFP and the BGA does not have to worry about pin deformation problems like QFP.
The BGA package currently has the following variations:
CBGA (Ceramic BGA)
FBGA (Fine BGA)
LBGA (Low-profile BGA)
LFBGA (Low-profile Fine-pitch BGA)
MBGA (Micro Ball Grid Array)
MAPBGA (Moulded Array Process BGA)
PBGA (Plastic BGA)
TBGA (Tape BGA)
TEPBGA (Thermally Enhanced Plastic BGA)
UBGA (Ultra Fine BGA)
...
This IC packaging can reach a close to a 1:1 ratio of chip area to package. The absolute size is only 32 square millimeters, which is about 1/3 of the ordinary BGA, 1/6 of the chip area of TSOP memory. Compared to the BGA, the CSP package in the same space can increase the storage capacity by three times.
CSP is just an IC packaging standard, every package type that reaches this ratio can be called CSP. Whether a PCB assembly house is able to deal with the CSP IC packaging or not reflects its assembly capabilities.
For more Custom Enclosure Solutionsinformation, please contact us. We will provide professional answers.
If you are interested in sending in a Guest Blogger Submission,welcome to write for us!
All Comments ( 0 )