Applications And Benefits Of Epoxy Potting Compound And ...

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Applications And Benefits Of Epoxy Potting Compound And Encapsulant

Electronic assemblies require protection against thermal dissipation, shock, vibration, corrosion, and moisture, among other elements. You can achieve protection through different methods, including potting. Potting is the process of filling the electronic assemblies with compounds that offer added protection to them permanently. Potted electronics are more durable and reliable in performance which is what every manufacturer and user is looking for.

The potting compounds used feature different materials, curing requirements and speed, and viscosities. The different characteristics are important because all electronic components do not need the same level of protection; what works for one component may not work as well for another. Epoxy, silicone, and urethane are the commonly used potting compounds; they each have advantages and disadvantages.

Epoxy potting compounds

Epoxy resin makes a great material for protecting electronic assemblies because it is resistant to most environmental conditions. Epoxy potting compounds are especially good for high temperatures and moisture environments. Their mechanical strength also makes them ideal for many other applications.

Essentially, what you stand to get from the compounds includes high tensile strength, rigidity, and dielectric properties. They offer the optimal solution to various electrical components, including transformers and switches.

The benefits

Potting tends to offer applications permanent protective solutions, thus increasing their durability and reliability. Epoxy compounds come with benefits like:

&#; Crack resistance

&#; Chemical protection

&#; Corrosion protection

&#; Improved mechanical strength

&#; Enhanced environmental protection

&#; Heat dissipation

&#; Electrical insulation

&#; Thermal shock and vibration resistance

The moisture resistance benefit of epoxy compounds in potting makes it an excellent choice for many, especially outdoor applications. The many characteristics of the resin have given it popularity in different sectors, including the automotive, aerospace, and consumer electronic industries.

Applications

As a result of the many impressive characteristics epoxy compounds have, they are largely used in the following:

&#; IP protection

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&#; Circuit protection for gas and oil sensors

&#; Printed circuit board protection, especially in commercial transportation

&#; LED drivers

&#; Transmitter components in deep-sea cables for telecommunication

Epoxy compounds are categorized in grades, but they all have self-leveling and low-viscosity characteristics. This makes them suitable for application with high production volumes and fragile component production lines. The grades can be formulated to achieve specific application requirements. For instance, the resin can be formulated to produce the thermal conductivity you prefer. You can also get a formulation that is room temperature curable or flame retardant.

The material you choose for potting your electronics will determine the results you get. It is important to ensure that you use only compounds that are best for the protection you are looking for. Using the wrong compounds will not only leave you with compromised protection but could also ruin your components permanently.

DeepMaterial is a manufacturer that can turn all your resin and adhesive dreams into reality. The company has experts who will formulate special compounds to match your applications in the best way and advise you on the best way to go with your potting. Products from the manufacturer are superior quality, so whether you are getting epoxy or silicone for your electronic components, you know you will get the very best.

For more about applications and benefits of epoxy potting compound and encapsulant,you can pay a visit to DeepMaterial at https://www.epoxyadhesiveglue.com/what-you-should-know-about-epoxy-potting-compound-and-epoxy-sealing-compound/ for more info.

Liquid resins are used in two main ways in encapsulations processes: glob top and dam & fill alternatively known as frame & fill

Epoxy Mold Compound vs Liquid Encapsulation

There are two main ways to encapsulate a semiconductor device: transfer molding a thermosetting Epoxy Mold Compound (EMC) or using liquid encapsulation directly on the Printed Circuit Board (PCB). Encapsulation in EMC is better than liquid encapsulation for applications that require higher filler content, and for the same reason, volume for volume, EMC is usually cheaper than liquid.

Liquid encapsulation, on the other hand, has a high flexibility and low through put

Liquid casting is however much more flexible. EMC requires are large significant investment in molding machines and mold plates for specific devices which must produce large quantities before there is a return on that investment. Liquid encapsulation on the other hand has a high flexibility and low through put: meaning that it is best suited for a multiple diverse low quantity orders.

In general liquid encapsulation is used for LEDs and potting or encapsulating electronics in bare die mounting on printed circuit boards (PCB), otherwise known as chip on board (COB).

Another advantage of potting and encapsulating devices in liquids is that in general, the result is flatter and thinner than devices encapsulated by a transfer molding process around a lead-frame with EMC. The space requirements for devices will continue getting more and more stringent as the component density of devices increases. This trend makes encapsulation and potting in liquids a sure bet for the future.

Transfer molding EMC may also cause wire sweep: where the pressure of the flowing molten compound shifts the fine-pitched bonding wires connecting a die. Wire sweep can cause shorts and mutual inductance. Liquid encapsulation is applied from above and does not disturb bonding wires. That&#;s why it is the industry standard for larger or extra sensitive dies and chips.

Liquid resin encapsulation via the glob top process is a single step application process but is less precise than dam & fill

Liquid Epoxy: Viscosity and Thixotropy

Bare die may be mounted to the PCB with die attach but that&#;s not enough to protect them or their connecting wires from moisture, mechanical stress, temperature, and chemical corrosion. That&#;s why it makes sense to insulate and encapsulate them with a protective potting layer of liquid encapsulant.

The low viscosity of liquid encapsulants is good for flat smooth finishes.

In non-Newtonian thixotropic encapsulants thixotropy refers to the temporarily lower viscosity of an epoxy gel when shear, pressure, or temperature is applied. This means that they can be gel-like when at rest, but flow like a liquid when agitated.

Being able to control the viscosity of liquid encapsulants means you can dial in how far they will spread over a surface area, and also how high they will build up to. This is important in Glob Top encapsulation where devices are literally encapsulated by a &#;Glob&#; from above.

Dam & Fill or Frame & Fill is a two step encapsulation process that is a little like 3d printing

Glob Top vs Dam & Fill

Glob Top is a process of encapsulation by using a fluid encapsulant gel with higher viscosity so that it fully encapsulates a device without flowing beyond the necessary area. As mentioned, by controlling the temperature, shear, and pressure, the viscosity and flow of liquid can be adjusted so that the final surface area and height of the &#;Glob&#; can be controlled quite effectively.

Dam & Fill on the other hand refers to a two-step process of encapsulation, where a ring or frame of higher viscosity liquid encapsulant is applied as a &#;Dam&#; around a device, and then a lower viscosity liquid &#;fill&#; is used to then fully encapsulate a device. The liquid used to build the frame or dam usually has more abrasive filler and a higher viscosity at rest than the liquid used for the fill.

Dam & Fill is a more selective protective coating and can be framed to cover areas in specific shapes, and is for example also used for optical bonding. In optical bonding the frame or dam is used to create a space between the glass and the display or touch screen. Then an optically clear fill is used as an adhesive and fixative.

Liquid Encapsulation for LEDs and Optoelectronic devices:

Optically clear liquid encapsulation is also used for LED devices, and encapsulate optical or optoelectronic devices that require both a high level of light transmittance as well as a good level of mechanical protection. In a similar process to Glob Top encapsulation, a literal glob of clear encapsulant is dropped directly into place on top of the LED. In another production process, optically clear liquid encapsulant is used to cast LED&#;s final body. Phosphor, colored dyes, and diffusant concentrates can be added to the liquid encapsulant to alter its optical properties.

If you are looking for more details, kindly visit Csp Encapsulation Silicone.